NEW! AgileSwitch Silicon Carbide IPM

(1) Mersen 1100VDC/510uF Film Capacitor Bank w/ Bracket & Snubbers (1) Mersen hollow fin heat sink with embedded heat pipes *There is a trade-off betw...

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NEW! AgileSwitch Silicon Carbide IPM For 50-200kW DC-AC Inverters/ DC-DC Converters PRODUCT DESCRIPTION AgileSwitch Silicon Carbide (SiC) Evaluation Kits are fast, powerful, and compact. They dramatically reduce the development time required to implement SiC Power Modules in DC-AC Inverters, DC-DC Converters and other power circuits.

KEY BENEFITS

APPLICATIONS

 Fast – up to 100kHz  Powerful – up to 200kW  Compact – Small 15”x 24” footprint (200kW IPM)  Cool – SiC Optimized cooling systems  Fully software configurable  Patented Multi-Level Shutdown

DCAC, DCDC, ACAC, ACDC       

Solar/PV Inverters Wind Turbines UPS/Battery Storage HEV/EV Motor Drives Induction Heating Frequency Conversion

BASIC TOPOLOGY

SiC IPM

Contact AgileSwitch, LLC 2002 Ludlow Street, 4th Floor Philadelphia, PA 19103 USA Tel: +1 (484) 483-3256 (US) +44 (0)1273 252994 (Europe) Email: [email protected] Web: AgileSwitch.com AgileSwitch is a trademark of AgileSwitch, LLC. Mersen is a trademark of Mersen SA AgileSwitch SiC IPM Data Sheet V04

Patents Pending © 2016 AgileSwitch, LLC All rights reserved.

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AgileSwitch Silicon Carbide IPM Evaluation Kit Options

1200V/300A GATE DRIVER KIT This individual gate driver kit is fully programmable and designed for experimenting with SiC modules as well as immediately moving to production with the standalone gate driver. Includes: (1) EDEM3 – AgileSwitch SiC Gate Driver (1) ROHM BSM300D12P2E001 SiC MOSFET (1200V/300A) (1) Device Programmer Kit

150kW/25kHz HEAT SINK (Embedded Heat Pipes) * In a compact footprint, this IPM is designed as a direct replacement for common IGBT-based power stacks and offers higher switching frequency and power output in an SiC optimized air-cooled heat sink package. Includes: (3) 1200V/300A Gate Driver Kits (1) INEX3A3 – AgileSwitch SiC Interface Board (3) High speed current sensors and bus bars (1) Mersen 1100VDC/510uF Film Capacitor Bank w/ Bracket & Snubbers (1) Mersen hollow fin heat sink with embedded heat pipes *There is a trade-off between output power and switching frequency.

200kW/30kHz HEAT PIPE ASSEMBLY This IPM allows testing SiC modules in a fully optimized air cooled environment. It is designed to allow the highest levels of power output, switching frequency and efficiency available with these modules without moving to chill plate and cooling systems assemblies. Includes: (3) Gate Driver Kits (1) INEX3A3 – AgileSwitch SiC Interface Board (3) High speed current sensors and bus bars (1) Mersen 1100VDC/510Uf Film Capacitor Bank w/ Bracket & Snubbers (1) Mersen Heat Pipe Assembly (1) DC or AC Fan with Shroud *There is a trade-off between output power and switching frequency. AgileSwitch SiC IPM Data Sheet V04

Patents Pending © 2016 AgileSwitch, LLC All rights reserved.

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